{"id":7802,"date":"2022-02-09T16:13:15","date_gmt":"2022-02-09T15:13:15","guid":{"rendered":"https:\/\/garnet.it\/?p=7802"},"modified":"2022-02-11T11:14:46","modified_gmt":"2022-02-11T10:14:46","slug":"1200v-reverse-conducting-igbt-modules","status":"publish","type":"post","link":"https:\/\/garnet.it\/en\/1200v-reverse-conducting-igbt-modules\/","title":{"rendered":"1200V reverse conducting IGBT modules optimized for hard switching &#8211; Fuji Electric"},"content":{"rendered":"\n<h3 class=\"wp-block-heading\">reverse-conducting (RC) IGBT modules<\/h3>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"alignleft size-large is-resized\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/garnet.it\/wp-content\/uploads\/2022\/02\/ggr.png\" alt=\"igbt modules\" class=\"wp-image-7810\" width=\"265\" height=\"232\" title=\"\" srcset=\"https:\/\/garnet.it\/wp-content\/uploads\/2022\/02\/ggr.png 397w, https:\/\/garnet.it\/wp-content\/uploads\/2022\/02\/ggr-300x262.png 300w\" sizes=\"auto, (max-width: 639px) 98vw, (max-width: 1199px) 64vw, 265px\" \/><\/figure><\/div>\n\n\n\n<p><a aria-label=\"Fuji Electric (opens in a new tab)\" href=\"https:\/\/garnet.it\/en\/partner\/fuji-electric-en\/\" target=\"_blank\" rel=\"noreferrer noopener\" class=\"rank-math-link\">Fuji Electric<\/a> has developed a <strong>1200V reverse-conducting (RC) IGBT modules <\/strong>based on the company\u2019s latest thin wafer process. <\/p>\n\n\n\n<p>The 1200V RC-IGBT enables increased module ratings:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>upgrading a Dual-XT package from 800A to 1000A,<\/li><li>upgrading a a small power integrated module (PIM) from 35A to 50A,<\/li><li>upgrading a PrimePack (TM of Infineon) from 1800A to 2400A.<\/li><\/ul>\n\n\n\n<p>At the same time, the reduced temperature ripple effect in power cycling improves the reliability of the modules.<\/p>\n\n\n\n<p>The performance of this RC-IGBT shows the same relationship between conduction loss and switching loss as Fuji&#8217;s 6th generation conventional IGBT and FWD.<\/p>\n\n\n\n<p>In addition its trade-off can be optimized for hard switching by lifetime killer.<\/p>\n\n\n\n<p>Calculations of the hard switching inverter loss and chip junction temperature (Tj) show that the optimized RC-IGBT can handle 35% larger current density per chip area.<\/p>\n\n\n\n<p>In order to utilize the high performance characteristics of the RC-IGBT, Fuji has developed a new compact package that has low thermal impedance and high reliability.<\/p>\n\n\n\n<p>This module can handle up to 30% higher current than conventional modules at a smaller footprint.<\/p>\n\n\n\n<p>Advantages of the new package include:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li><strong>Compact: <\/strong><\/li><\/ul>\n\n\n\n<p>conventional package uses Aluminum wire bonding and a circuit pattern on the DCB substrate for the connection between chips and terminals. These methods need a certain amount of area for the wire bonding and the circuit.<\/p>\n\n\n\n<p>The smaller dimensions of the chip RC \u2013 considering IGBT + FWD \u2013 optimize the internal area and the related connections to build the module and, at the same rating, the overall dimension of the module will be smaller.<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li><strong>Low thermal impedance: <\/strong><\/li><\/ul>\n\n\n\n<p>the new structure uses Si3N4 for insulating material, which thermal resistance is less than half of conventional materials like Al2O3.<\/p>\n\n\n\n<p>In addition the new structure uses a thick copper plate on both sides of ceramic substrate.<\/p>\n\n\n\n<p>These copper plates effectively spread the heat from the chips to the cooling fin. As a result the thermal impedance of our new structure is much lower compared to conventional structure.<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li><strong>High reliability: <\/strong><\/li><\/ul>\n\n\n\n<p>regarding the reliability of an IGBT module, power cycling capability has the biggest impact.<\/p>\n\n\n\n<p>In the power cycling test, due to the different temperature coefficients, all the material used in the module construction are prone to potential problems; among them &nbsp;the wire bonding on the chip and the solder layer between chips and the DCB substrate are some of the weak points of the conventional structure.<\/p>\n\n\n\n<p>The new package is using new materials thought to efficiently deal with the higher temperatures generated by the higher currents the module is able to manage.<\/p>\n\n\n\n<p>Because of this the power cycling capability is better than the one provided by the conventional modules and this guarantee higher reliability and longer lifetime.<\/p>\n\n\n\n<p>The module footprint of the new package is smaller than that of the conventional package and the chip size of the downsized RC-IGBT is 26% smaller than that of the conventional IGBT and FWD.<\/p>\n\n\n\n<p>The Rth(jc) of the downsized RC-IGBT assembled in the new package is much lower than that of the conventional IGBT assembled in conventional package and this improves the chip heat dissipation.<\/p>\n\n\n\n<p><a rel=\"noreferrer noopener\" href=\"https:\/\/garnet.it\/en\/partner\/fuji-electric-en\/\" target=\"_blank\">Fuji Electric<\/a> believes that the combination of the RC-IGBT and the revolutionary package is promising candidate for the downsizing of IGBT and increasing the power density of the complete inverter systems.<\/p>\n\n\n\n<p>For more information about <strong>RC-IGBT modules <\/strong>don&#8217;t hesitate to contact us at <a rel=\"noreferrer noopener\" href=\"mailto:info@garnetitalia.com\" target=\"_blank\">info@garnetitalia.com<\/a> <\/p>\n","protected":false},"excerpt":{"rendered":"<p>reverse-conducting (RC) IGBT modules Fuji Electric has developed a 1200V reverse-conducting (RC) IGBT modules based on the company\u2019s latest thin wafer process. The 1200V RC-IGBT enables increased module ratings: upgrading a Dual-XT package from 800A to 1000A, upgrading a a small power integrated module (PIM) from 35A to 50A, upgrading a PrimePack (TM of Infineon) [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":7815,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[998],"tags":[],"class_list":["post-7802","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-products"],"acf":[],"_links":{"self":[{"href":"https:\/\/garnet.it\/en\/wp-json\/wp\/v2\/posts\/7802","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/garnet.it\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/garnet.it\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/garnet.it\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/garnet.it\/en\/wp-json\/wp\/v2\/comments?post=7802"}],"version-history":[{"count":14,"href":"https:\/\/garnet.it\/en\/wp-json\/wp\/v2\/posts\/7802\/revisions"}],"predecessor-version":[{"id":7819,"href":"https:\/\/garnet.it\/en\/wp-json\/wp\/v2\/posts\/7802\/revisions\/7819"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/garnet.it\/en\/wp-json\/wp\/v2\/media\/7815"}],"wp:attachment":[{"href":"https:\/\/garnet.it\/en\/wp-json\/wp\/v2\/media?parent=7802"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/garnet.it\/en\/wp-json\/wp\/v2\/categories?post=7802"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/garnet.it\/en\/wp-json\/wp\/v2\/tags?post=7802"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}