Fuji Electric Co., Ltd. (headquartered in Tokyo, Japan; led by President Michihiro Kitazawa) is pleased to announce that it has expanded the lineup of its 7th-generation X Series of IGBT modules, targeting the large-scale wind power generation market, and has begun sample shipment of 1,700V withstanding voltage products.
7th-Generation X Series IGBT Modules
Aim
IGBT modules are mounted on industrial equipment such as inverters for driving motors, uninterruptible power supplies (UPSs), and power conditioning systems(PCS) for wind or photovoltaic power generation facilities, and are key devices in achieving both energy conservation and a stable electric power supply.
In 2015, Fuji Electric launched its 7th-generation X Series of IGBT modules with withstanding voltages of 650V and 1,200V, contributing to energy conservation and a stable electric power supply for a wide range of equipment and facilities, including inverters for controlling air conditioners and motors, UPSs, and PCS.
Fuji Electric has recently expanded its lineup of 1,700V withstanding voltage products, targeting the large-scale wind power generation market.
Amid increasing awareness of environmental issues, demand for clean energy, mainly from renewable energy sources, is growing around the world.
The market for industrial-use IGBT modules is expected to grow at an annual rate of 3.5% from about 350 billion yen in 2018. More and more large-scale wind power generation facilities are being constructed, particularly in Europe and China, and the global market for such facilities is expected to grow by 591 GW in 2018 and 8% annually by 2023 (source: GWEC).
With this lineup expansion, Fuji Electric aims to further expand sales of its 7th-generation X Series of IGBT modules.
Features of the 7th-Generation X Series
- Achieves energy saving by reducing power loss
The IGBT module combines and packages an IGBT, which turns the current on and off, with a diode, which has a freewheeling function (FWD).
With this product, Fuji Electric has made the IGBT and FWD thinner and the surface structure of the IGBT finer. This has reduced power loss during inverter operation by approximately 10% compared to the conventional product (6th-generation V Series). It also contributes to energy saving and to reducing the power cost of installed equipment.
- Contributes to downsizing of equipment
A newly developed insulating substrate has been applied to improve the heat dissipation of the module. In addition to the abovementioned reduced power loss, heat generation is suppressed, increasing the maximum guaranteed temperature for continuous operation from the conventional 150°C to 175°C, enabling an increase of up to 30%* in output current while maintaining the size of the installed equipment. This contributes to downsizing of equipment and reduction of total cost.
(*): Value estimated from simulation results
Contributes to better equipment reliability
The module structure and materials used were reviewed to improve stability and durability during operation at high temperatures. This contributes to improving the reliability of installed equipment.
Information conveyed in this release (product features, inquiry information, etc.) is accurate as of the date of this announcement and is subject to change without prior notice.
PrimePACKTM is a registered trademark of Infineon Technologies AG.
Product Specifications
| Rated Voltage | Rated Current | Package Type | Sample shipment start date |
| 1.700V | 75A – 400A | Std. 2in1 | Starting from July 2019 |
| 225A – 600A | Dual XT | ||
| 650A – 1800A | PrimePACKTM | ||
| 1000A – 1200A | HPnC |
1,700V Lineup and Major Specifications
| Package type | Rated Current | Model | Circuit configuration | Dimensions (mm) | Sample shipment start date |
| Standard 2in1 | 75A | 2MBI75XAA170-50 | 2in1 | 34×94 | Starting from July 2019 |
| 100A | 2MBI100XAA170-50 | ||||
| 150A | 2MBI150XAA170-50 | ||||
| 150A | 2MBI150XHA170-50 | 62×108 | |||
| 200A | 2MBI200XHA170-50 | ||||
| 300A | 2MBI300XHA170-50 | ||||
| 400A | 2MBI400XHA170-50 | ||||
| 300A | 2MBI300XEE170-50 | 80×110 | |||
| 400A | 2MBI400XEE170-50 | ||||
| Dual XT | Solder pins | 225A | 2MBI225XNA170-50 | 62×150 | Starting from November 2019 |
| 300A | 2MBI300XNA170-50 | ||||
| 450A | 2MBI450XNA170-50 | ||||
| 600A | 2MBI600XNG170-50 | Starting from July 2019 | |||
| 2MBI600XNE170-50 | |||||
| Press Fit pins | 225A | 2MBI225XNB170-50 | Starting from November 2019 | ||
| 300A | 2MBI300XNB170-50 | ||||
| 450A | 2MBI450XNB170-50 | ||||
| 600A | 2MBI600XNH170-50 | Starting from July 2019 | |||
| 2MBI600XNF170-50 | |||||
| PrimePACKTM2 | 650A | 2MBI650XXA170-50 | 89×172 | Starting from November 2019 | |
| 1200A | 2MBI1200XXE170-50 | ||||
| PrimePACKTM3 | 1000A | 2MBI1000XXB170-50 | 89×250 | ||
| 1400A | 2MBI1400XXB170-50 | ||||
| 1800A | 2MBI1800XXF170-50 | ||||
| PrimePACKTM3+ | 1800A | 2MBI1800XXG170-50 | 89×250 | ||
| HPnC | 1000A | 2MBI1000XVF170-50 | 100×144 | Starting from December 2019 | |
| 1200A | 2MBI1200XVF170-50 | Starting from January 2019 |
PrimePACKTM is a registered trademark of Infineon Technologies AG.
For more information please contact: info@garnetitalia.com